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Semiconductor device
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#	Item
111	The 19th International Conference on Crystal Growth and Epitaxy (ICCGE-19) Keystone, Colorado, U.S.A. * July 28–August 2, 2019 and th The 17 International Summer School on Crystal Growth (ISSCG-17) Add to Reading List Source URL: www.crystalgrowth.org Language: English - Date: 2016-07-21 08:38:28 Semiconductor device fabrication Thin film deposition Crystallography Epitaxy Crystal
112	Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En Add to Reading List Source URL: web.eecs.umich.edu Language: English - Date: 2016-04-25 13:15:14 Semiconductor device fabrication Plasma processing Plasma physics Microtechnology Measuring instruments Plasma Reactive-ion etching Langmuir probe Crystal oscillator Etching Microwave Plasma diagnostics
113	Produktblatt_Cleaning2016.indd Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-06-30 03:44:06 Semiconductor device fabrication Wafer KLA-Tencor Fraunhofer Society
114	Copy of Session Schedule Combined Master.xlsx Add to Reading List Source URL: www.iwlpc.com Language: English - Date: 2016-08-15 13:37:41 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Wafer-level packaging Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array SUSS MicroTec System in package Chip-scale package Through-silicon via Microelectromechanical systems
115	Laser cooled cesium atoms as a focused ion beam source Matthieu Viteau Orsay Physics, 95 avenue des Monts Auréliens, Fuveau, France FIB (Focused Ion Beam) technology is an essential tool in many fields such as semicondu Add to Reading List Source URL: www.ino.it Language: English - Date: 2013-02-06 06:59:57 Ion source Semiconductor device fabrication Thin film deposition Ions Accelerator physics Focused ion beam Liquid metal ion source Ion beam Gallium Ion Plasma Fib
116	High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS Add to Reading List Source URL: web.eecs.umich.edu Language: English - Date: 2016-04-25 13:15:12 Semiconductor device fabrication Microtechnology Etching Plasma processing Chemical milling Isotropic etching Plasma etching Microelectromechanical systems Buffered oxide etch
117	Microsoft Word - PR-NBTI_June7 Add to Reading List Source URL: www.ridgetopgroup.com Language: English - Date: 2015-07-18 01:30:09 Electronic engineering Semiconductor devices Negative-bias temperature instability Semiconductor device fabrication Hot-carrier injection Semiconductor intellectual property core Transistor
118	Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronics manufacturing Packaging Microtechnology Semiconductor device fabrication Wafer bonding SUSS MicroTec Wafer Microelectromechanical systems Acoustic microscopy Silicon on insulator Eutectic bonding Capacitive micromachined ultrasonic transducers
119	ultrasound, acoustic imaging, wafer gaps, MEMS ~. Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Semiconductor device fabrication Wafer Acoustic microscopy Microelectromechanical systems Die Wafer dicing Radio frequency microelectromechanical system
120	Microsoft Word - IBSNew_Trends_in_iTECH-final Add to Reading List Source URL: foibg.com Language: English - Date: 2015-02-02 08:46:13 Survival analysis Reliability engineering Failure Actuarial science Semiconductor device fabrication Failure rate Exponential distribution Reliability theory MIL-STD-883 Reliability Probability distribution

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